NXP Semiconductors→
Die Bond Process Engineer at NXP… · Kaohsiung
Mid LevelOn-siteKaohsiung, Kaohsiung, Taiwan
Skills
die bond processroot cause analysisprocess optimizationdata analysisprocess reportinganalytical skillsproblem-solvingcommunicationteam-oriented mindsetsemiconductor packaging processes
Job Description
**Key Responsibilities**
- Assist in establishing and maintaining the Die Bond process
- Monitor daily production to ensure process stability, yield, and quality performance
- Conduct root cause analysis (RCA) of process issues and implement corrective and preventive actions
- Support new product introduction (NPI), including process setup, validation, and documentation
- Optimize process parameters to improve yield, efficiency, and reliability
- Collaborate with cross-functional teams (e.g., Production, Equipment, Quality, Innovation)
- Analyze data and prepare process reports
- Participate in continuous improvement projects (e.g., cost reduction, capacity increase)
**Education & Qualifications**
- Bachelor’s or Master’s degree in a related field, including:
- Materials Science
- Chemical Engineering
- Mechanical Engineering
- Electrical / Electronic Engineering
- Basic knowledge of semiconductor packaging processes is preferred
- Strong analytical and problem-solving skills
- Good communication skills and a team-oriented mindset
- English proficiency: TOEIC score of 650 or above, or equivalent certification
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