VP, Advanced Packaging Technology Lead at Amkor… · Tempe

Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.

Position Summary:

Amkor is currently seeking a VP, Advanced Packaging Technology Lead for our Peoria, AZ office (ATA). The primary function of this position is to lead the strategy, development, and commercialization of advanced IC packaging solutions for the computing, networking, PC, mobile, and emerging AI market segments. This person will report into the Chiplets/FCBGA Business Unit and serve as a key interface between the Chiplets/FCBGA BU, ATA factory leadership, Tier 1 customers, and Amkor's leading-edge R&D center in South Korea, driving technology roadmaps, customer engagement, and successful execution of advanced packaging initiatives.

Essential Duties and Responsibilities:

• Lead and coordinate advanced packaging development activities with customers and Amkor's development teams, ensuring alignment with business objectives, technology roadmaps, and market requirements.
• Drive strategic engagement with Tier 1 customers, including roadmap discussions, executive reviews, technology planning, and development program oversight for advanced packaging products.
• Collaborate across engineering, operations, manufacturing, sales, and R&D organizations to ensure successful execution and commercialization of new packaging technologies.
• Serve as a key liaison between the Chiplets/FCBGA Business Unit, ATA operations, and global R&D teams to accelerate technology transfer and manufacturing readiness.
• Maintain ownership of product strategy and development through qualification, initial production ramp, and sustained business growth.
• Lead cross-functional decision-making, risk management, and resource alignment to achieve program, customer, and business objectives.

Required Qualifications:

• This position requires a Bachelor's degree in Engineering (Materials Science, Mechanical, Electrical, or Chemical); Master's degree is preferred.
• 15+ years of experience in semiconductor packaging development is required, or a minimum of 13+ years with a Master's degree.
• The qualified candidate will be able to work independently in a global organization and have demonstrated experience leading advanced IC packaging development initiatives.
• The qualified candidate must understand the IC package design environment and trade-offs associated with package design during package process development.
• Deep knowledge of IC packaging materials, failure modes, and reliability qualification procedures is required.
• Demonstrated experience translating customer requirements and technology trends into packaging development strategies and execution plans.
• Direct previous product management experience involving offshore process development is highly desired.
• Demonstrated leadership, organizational influence, and team-building capabilities.
• Excellent written, verbal, and executive-level communication skills are required.
• This position requires 20% domestic and 20% international travel.

Preferred Qualifications:

• Working knowledge of heterogeneous packaging and a strong understanding of trade-offs between various IC packaging technologies.
• Knowledge of thermal and mechanical simulations, modeling, and performance optimization techniques.
• Familiarity with Design of Experiments (DOE), Statistical Process Control (SPC), and product positioning or marketing support activities.
• Strong knowledge of fault isolation and failure analysis techniques.
• Demonstrated experience translating customer product roadmaps into advanced IC packaging technology roadmaps.
• Familiarity with advanced packaging applications supporting AI, high-performance computing, networking, and next-generation computing platforms.

Location:

The interim location will be Tempe, AZ during the construction phase of Amkor's new facility in Peoria, AZ. Upon completion, this role will be based in Peoria, AZ. The position may require the initial 3 to 6 months to be a global assignment in Songdo, S. Korea (ATK5).

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.