Teledyne Technologies Incorporated→
Process Development Engineer at Teledyne… · Mountain…
Entry LevelOn-siteFull-timeMountain View, CA$73k–$97k/yr
Skills
thin-film hybrid assemblymic processeseutectic attachepoxy attachbond pullgap weldingsealingpaintingroot cause analysisprocess developmentauto wire-bondingdie attachprocess transferscad softwarelean manufacturingpfmeaspc methodologiesiso9001microsoft officesolidworks
Job Description
Summary: Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. The Process Development Engineer will drive innovation in advanced manufacturing processes, supporting thin-film hybrid assembly and MIC processes, troubleshooting assembly methods, and leading process transfers from NPI to production.
Responsibilities:
- Provide process engineering support for thin-film hybrid assembly and MIC processes
- Support assembly methods including eutectic attach, epoxy attach, bond pull, gap welding, sealing, and painting
- Troubleshoot new assembly processes and resolve in-process technical issues with root cause analysis
- Participate in process development, research, and continuous improvement initiatives
- Generate ECOs and maintain accurate assembly documentation
- Assist in new product development with emphasis on auto wire-bonding and die attach
- Lead process transfers from NPI to production and design tooling using CAD software
- Analyze production data and implement solutions using Lean, PFMEA, and SPC methodologies
Required Qualifications:
- Bachelor's degree in engineering or equivalent with 1+ years of experience in electronics manufacturing
- Familiarity with AS9100/ISO9001 standards and lean manufacturing principles
- Strong analytical, problem-solving, and communication skills
- Must be a U.S. citizen and able to obtain and maintain a government security clearance
Preferred Qualifications:
- Background in electronics assembly processes such as wire bonding and die attach
- Knowledge of process tooling design and application
- Proficiency in Microsoft Office; SolidWorks experience preferred
Required Skills: Thin-film hybrid assembly, MIC processes, Eutectic attach, Epoxy attach, Bond pull, Gap welding, Sealing, Painting, Root cause analysis, Process development, Auto wire-bonding, Die attach, Process transfers, CAD software, Lean manufacturing, PFMEA, SPC methodologies, ISO9001, Microsoft Office, SolidWorks
Benefits: Competitive pay and comprehensive health benefits, 401(k) with company match and retirement plans, Paid time off and flexible work arrangements, Professional development and training opportunities, Employee wellness programs and assistance resources
Benefits
Competitive pay and comprehensive health benefits
401(k) with company match and retirement plans
Paid time off and flexible work arrangements
Professional development and training opportunities
Employee wellness programs and assistance resources