Senior Firmware Engineer at Teledyne · Richmond

Senior Firmware Engineer
Location: Canada - Richmond, BC
Be visionary
Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​
We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.
Job Description
SeniorFirmwareEngineer,MachineVisionCameras
If you enjoy working close to the hardware, this is an opportunity to build the firmware that powers industrial cameras used in machine vision applications around theworld.JoinTeledyneFLIRIntegratedImagingSolutionsandhelpturnadvancedimagesensors,FPGAs,andembeddedprocessorsintoproductsusedinautomation,robotics,inspection,measurement,andintelligenttransportationsystems.
You’llworkalongsideFPGA,hardware,andsoftwareengineers,owningfirmwarecomponentsfromdesignthroughreleasewhilehelpingshapethenextgenerationofimagingplatforms.
Whatyou’lldo
DesignanddevelopembeddedfirmwareinCforcameraplatforms.
Buildlow-leveldriversandboardsupportfunctionalityforFPGA-hostedprocessors.
Defineprocessor-to-FPGAinterfaces,includingregistermaps,DMApaths,andinterrupts.
DevelopandmaintainGenICam,GigEVision,USB3Vision,andrelatedinterfacestacks.
Optimisereal-timeperformance,memoryuse,andstreamingthroughput.
Supportboardbring-up,debugging,andfirmwarereleases.
Investigatecustomer-reportedissuesandplatform-leveltechnicalchallenges.
CollaboratewithFPGA,hardware,manufacturing,andtestteams.
Leadtechnicalreviewsandcontributetoprojectplanning.
Mentorengineersthroughdesigndiscussions,reviews,andknowledgesharing.
Whatyouneed
Required:ExpertembeddedCdevelopmentandworkingknowledgeofC++.
Required:RTOS,bare-metal,interrupt-driven,andDMA-basedsystemdesign.
Required:Firmware-to-FPGAinterfacingandcommunicationprotocolssuchasEthernetandUSB.
Required:Experiencedebugginghardwareusingschematics,datasheets,andoscilloscopes.
Required:Demonstratedtechnicalleadershipandstrongcommunicationskills.
Required:8+years(Bachelor’s),6+years(Master’s),or3+years(PhD)ofrelevantexperience.
Required:DegreeinComputerEngineering,ElectricalEngineering,ComputerScience,orrelatedfield.
Advantage:ExperiencewithXilinx/IntelFPGAs,machinevisionstandards,embeddedLinux,imageprocessing,scripting,orFPGAdevelopment.
Whatweoffer
Workonproductsdeployedindemandingreal-worldapplications.
Closecollaborationacrossfirmware,FPGA,hardware,andsoftwareteams.
Opportunitiesfortechnicalleadershipandmentoring.
On-sitedesignandmanufacturingenvironmentwithdirectproductvisibility.
Accesstoadvancedimagingtechnologiesandengineeringexpertise.
Whathappensnext
Applicationsarereviewedbytherecruitingteam,followedbyarecruiterdiscussionandinterviewswiththehiringteam.Timelinesvarybyroleandhiringrequirements.
TeledyneFLIRIntegratedImagingSolutionsdesignsandmanufacturesmachinevisionproductsbuiltaroundleading-edgeimagesensors.
Salary Range:
$93,700.00-$124,900.000
The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.
Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.