Thermal Engineer

Summary: Supermicro is a Top Tier provider of advanced server, storage, and networking solutions for various customers worldwide. They are seeking a passionate Thermal Engineer responsible for the architecture, design, analysis, and validation of water cooling technologies to meet HPC customer needs. Responsibilities: - Develop and validate thermal solution for HPC cluster platforms with respect to industry standards - Evaluate all of the system layout, power consumptions, air flow, acoustics, sensors and related mechanical testing - Perform cluster level thermal analysis, definition, testing (including chamber test set up, thermocouple installation, automated data acquisition) - Thermal debugging, system optimization and documentation - Analyze structural and thermal aspects to ensure feasibility and specify thermal interface materials and manufacturing process - Responsible for development, design, documentation and deployment of all cluster level water cooling customer projects - Additional responsibilities will include rack integration, documentation, facilities preparation, on-site service, & PM/Sales/Field Application Engineer customer project support Required Qualifications: - Bachelor degree in Aerospace, Thermal, or Mechanical Engineering; Master's degree is a plus - Minimum 1 year of experience in server/PC industry with mechanical or thermal function is required - Must have working knowledge in thermal management hardware, heat transfer material, and cooling devices at a rack/cluster level - Solid knowledge in general Mechanical/thermal engineering analysis, validation, documentation and communication - Knowledge of mechanical/thermals (cooling devices, air flow, temp, power, cooling, mechanical design) with electrical/power (power distribution, AC power types, power calculations, DC power, regulatory/safety) is a plus - Must have good working spirit and work well in a team and fast-paced environment - Strong organizational and problem solving skills - Solid communication skills, both verbal and written - Able to travel for on-site customer deployments Preferred Qualifications: - Knowledge of mechanical/thermals (cooling devices, air flow, temp, power, cooling, mechanical design) with electrical/power (power distribution, AC power types, power calculations, DC power, regulatory/safety) is a plus - Server/Rack Liquid Cooling solutions experiences are plus which include DCL(direct chip liquid cooling), rear door liquid cooling, liquid immersion cooling, chilled water piping, etc. is a plus Required Skills: Thermal management hardware, Heat transfer materials, Cooling devices, Thermal analysis, Mechanical engineering analysis, Thermal validation, Thermal debugging, Rack/cluster level cooling solutions, Direct chip liquid cooling (DCL), Rear door liquid cooling, Liquid immersion cooling, Chilled water piping, Power distribution, AC power types, DC power, Regulatory/safety standards Benefits: In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation, such as participation in bonus and equity award programs.