RTX→
Microelectronics Packaging Intern (Summer… at RTX · US-IA-CED…
InternshipOn-siteFull-timeUS-IA-CEDAR RAPIDS-108 ~ 400 Collins Rd NE ~ BLDG 108$37k–$82k/yr
Skills
mechanical engineeringmicroelectronics design2d/3d cadthermal conceptsadditive manufacturingelectronic component testingfailure analysispost wafer fabrication
Job Description
Summary: RTX is a leader in technologically advanced and intelligent solutions for the global aerospace and defense industry. The Microelectronics Packaging group within RTX is seeking a Mechanical Engineering intern to participate in product development activities, coordinate prototype builds, and support the transition of products into production.
Responsibilities:
- You will participate in Microelectronics product development activities including packaging concepts, preliminary/detailed board design and package road mapping efforts
- You will develop technologies required for next generation packages
- You will coordinate prototype package builds and evaluation efforts
- You will qualify microelectronic packages
- You will support factory transition of products
- You will provide manufacturing support for Microelectronic assemblies currently in production
Required Qualifications:
- Requires a High School Diploma or equivalent and student must be pursuing a Bachelor's or advanced degree in an applicable discipline
- U.S. citizenship is required, as only U.S. citizens are authorized to access information under this program/contract
Preferred Qualifications:
- Candidates for this role should be pursuing an engineering degree from an accredited University in a Science, Technology, Engineering, or Math (STEM) discipline
- Working knowledge of mechanical 2D/3D CAD, basic electrical circuits, thermal concepts
- Experience with or knowledge of microelectronics design and manufacturing assembly and packaging materials and material properties
- Electronic component reliability testing
- Post wafer fabrication processes
- Failure analysis techniques
- Additive Manufacturing
Required Skills: Mechanical Engineering, Microelectronics Design
Important Skills: 2D/3D CAD, Thermal Concepts, Additive Manufacturing
Nice-to-Have Skills: Electronic Component Testing, Failure Analysis, Post Wafer Fabrication
Internship Start Date: Start in 2026 Summer
Benefits: Medical, Dental, Vision, Life insurance, Short-term disability, Long-term disability, 401(k) match, Flexible spending accounts, Flexible work schedules, Employee assistance program, Employee Scholar Program, Parental leave, Paid time off, Holidays
Benefits
Medical
Dental
Vision
Life insurance
Short-term disability
Long-term disability
401(k) match
Flexible spending accounts
Flexible work schedules
Employee assistance program
Employee Scholar Program
Parental leave
Paid time off
Holidays