Staff Packaging Engineer at Power Integrations in Malaysia, Malaysia

Job Description Staff Packaging Engineer – Ayutthaya, Thailand

We’re hiring a hands-on Resident Package Engineer at a key OSAT partner to support mass production of multi-die wirebond leadframe packages. You will focus on sustaining manufacturing performance, supplier process control, and robust release-to-manufacturing (RTM) protocols to ensure product quality, yield and on-time delivery. Key responsibilities • Act as the on-site technical owner at the OSAT for all packaging activity; act as primary engineering interface between OSAT operations and our packaging / product teams. • Support and troubleshoot day-to-day production issues (quality holds, yield excursions) and lead root-cause analysis and permanent corrective actions (8-D, RCA). • Implement and maintain RTM artifacts including process flows, control plans, work instructions, and SOPs. • Drive process control and SPC: define control charts, sample plans, capability studies (Cp/Cpk) and guardbanding for critical steps (die attach, wirebond, mold, trim/form, plating). • Oversee supplier change control and PCNs (Process Change Notices), BOM/process releases and supplier qualification runs. • Participate in supplier audits and periodic process/quality audits at the OSAT; capture and escalate nonconformances. • Run process characterization and DOE to improve yield, quality, capacity, and cycle time; document outcomes and update process specs. • Coordinate failure analysis and disposition of discrepant material (with material review board support). • Work with NPI and sustaining teams to transfer new or revised processes into consistent mass production practices. • Report KPIs weekly (yield, DPPM, escape rate, cycle time, open corrective actions). Required qualifications • B.S. in Electrical, Mechanical, Materials, Chemical engineering or related discipline. • Minimum of 8 years’ experience in semiconductor back-end assembly — volume production experience required. • Strong practical knowledge of wirebond processes, leadframe design considerations, clip bonding, plating and molding/encapsulation. • Strong problem solving using 8-D, FMEA, DOE, SPC • Experience with QC/FA tools (cross-section, decap, SEM, X-ray) and reading FA reports. • Excellent communication skills — able to write process specs • Willingness to be based full-time at the OSAT site with occasional travel to Malaysian operations hub in Penang. Additional preferred qualifications • Direct experience producing power packages or automotive qualification work. • Knowledge of AEQ Automotive reliability requirements • Knowledge of APQP automotive development process • Knowledge of JEDEC/IPC standards • Ability to work in a fast-paced environment • Able to occasionally work with colleagues in the US timezone