Physical Failure Analysis Engineer at NXP… · Kuala…

Physical failure analysis (PFA) involves the localisation, imaging, and characterisation of manufacturing defects in our products. Analysts will be expected to:

• Utilise a wide variety of fault localisation and imaging tools/techniques, including but not limited to Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Energy Dispersive X-ray Spectroscopy (EDX), Focused Ion Beam (FIB), SEM-based Nanoprober
• Understand electrical failure analysis (EFA) data and determine the best PFA plan forward based on that data
• Document findings in professional reports to be shared with various stakeholders
• Collaborate with cross-departmental teams such as Customer Quality Engineering, Manufacturing, and other FA labs
• Have an understanding of manufacturing processes and the root cause of defects

Job Qualification

• Bachelor's or Master's degree ​in Electrical/Electronics/Materials Engineering
• Fresh Graduates or with not more than 2 years’ work experience
• Basic technical knowledge of semiconductor physics and MOSFET operations
• Knowledge of common computer software packages, such as Word, Excel, PowerPoint, etc
• Able to work with chemicals, X-Ray, Electron and Ion Beam tools
• Comfortable with handling small and delicate samples with tweezers

The following are not required but would be a benefit/plus:

• Experience in a laboratory/wafer fab/similar manufacturing environment
• Experience with beam tools (SEM/TEM/FIB)
• Familiar with the FA process flow and analysis techniques
• Knowledge of semiconductor manufacturing processes (wafer fabrication as well as assembly)
• Strong problem solving skills, (e.g., 8D or similar practice) attention to detail, good communication skills (both written and verbal) and the ability to produce quality results in a timely fashion are also essential attributes.

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