Sr Principal TIA Designer at Nokia in Location not listed

Sr Principal TIA Designer

Location: United States

Join Nokia's advanced photonics and semiconductor design team, developing next-generation analog ICs for high-speed optical communication systems. In this role, you will lead the design of multi-tens of GHz Transimpedance Amplifiers (TIAs) for coherent long-haul, metro, and PAM4 data center applications, leveraging cutting-edge SiGe BiCMOS and CMOS technologies. You'll play a key role in delivering innovative solutions that enable faster, more efficient data transmission across data centers, telecommunications networks, and emerging AI-driven infrastructure.

NION2026

• Lead the architecture, design, simulation, verification, and silicon bring-up of ultra-high-speed Transimpedance Amplifiers (TIAs) for coherent optical and PAM4 data center applications.

• Translate system and chip-level requirements into robust analog circuit architectures and detailed transistor-level designs.

• Design and optimize low-noise, high-linearity broadband analog circuits for optical receiver front ends.

• Develop and validate supporting analog functions, including AGC loops, CTLEs, voltage regulators, bandgaps, and data converter interfaces.

• Drive package and system-level integration, ensuring optimal signal integrity and performance.

• Perform silicon characterization, debug, and correlation of measurement results against simulation models.

• Collaborate closely with layout, system, DSP, packaging, and product engineering teams throughout the development cycle.

• Lead technical reviews, contribute to design methodology improvements, and ensure successful first-pass silicon execution.

• Mentor and guide junior analog designers, fostering technical excellence within the team.

• Create and maintain high-quality technical documentation, design reports, and specifications.

• Extensive experience designing high-speed TIAs for coherent optical communication systems and/or PAM4 data center transceivers.
• Strong expertise in analog and mixed-signal IC design using SiGe BiCMOS and CMOS technologies.
• Deep understanding of transistor-level circuit design, device physics, noise analysis, and feedback/control loop stability.
• Proven experience in one or more of the following areas:
  • Optical receiver front-end design
  • AGC loop implementation
  • CTLE design
  • High-precision analog circuits (bandgaps, regulators, ADC/DAC interfaces)
  • Package and system-level integration
• Proficiency with industry-standard EDA tools, custom analog layout techniques, and electromagnetic (EM) simulation tools.
• Demonstrated success delivering silicon from concept through production.
• Hands-on experience with lab measurement, debugging, and performance validation of high-speed ICs.
• Strong leadership, problem-solving, communication, and collaboration skills.
• Ability to work effectively in a fast-paced, multidisciplinary global engineering environment.