Semi Mfg Technician 2 (ASSM - S6) at Nokia in Location not listed

As an Assembly Operator at Nokia, you will play a crucial role in the precision assembly of cutting-edge optoelectronic devices used in advanced telecommunications. Your expertise in manual die attaching, wire bonding, and meticulous inspection ensures the highest quality standards, directly contributing to the development of innovative technology solutions that empower connectivity in our global communities. By maintaining stringent safety and cleanliness standards in our cleanroom environment, you will support Nokia's commitment to excellence and sustainability, helping to shape the future of communications technology. Join us in driving breakthroughs that connect the world.

As an Assembly Operator at Nokia, you will play a vital role in our innovative team, directly contributing to the manufacturing of advanced optoelectronic devices. Working in a state-of-the-art cleanroom environment, you'll utilize your precision skills to manually attach Photonic Integrated Circuits (PICs), perform wire bonding, and inspect devices for quality assurance. Your keen eye for detail will ensure every product meets our high standards, while your ability to communicate effectively with management and engineers will help address any unexpected results swiftly. Collaborating closely with your colleagues, you’ll help drive efficiency in our processes and maintain safety and cleanliness standards. This role not only requires technical expertise but also offers an opportunity to be part of a groundbreaking team dedicated to pushing the boundaries of technology. Join us and make a significant impact in the world of optoelectronics!

For shift 6, 6:00AM - 6:00PM, Friday - Sunday and every other Thursday.

Responsibilities

• Process and assemble optoelectronic devices in a cleanroom environment, ensuring high standards of quality.
• Perform meticulous inspections on devices using microscopes to identify and address processing defects.
• Execute manual die attachment of Photonic Integrated Circuits (PICs) and surface-mounted devices with precision.
• Utilize semi-automated tools for wire bonding, ensuring consistent and reliable connections.
• Accurately enter and manage data in the Manufacturing Execution System (MES) for tracking and reporting purposes.
• Communicate effectively with team members regarding tool and lot status for seamless shift transitions.
• Adhere strictly to Fab safety and cleanliness protocols to maintain a compliant working environment.
• Proactively inform management and engineers of any unexpected results to facilitate immediate resolutions.

Qualifications

You have:

• High school diploma or GED.
• Hand dexterity to manage small precision tools such as tweezers and vacuum wands.
• Basic computer skills for email, spreadsheets, and data entry.
• Ability to work effectively in a cleanroom environment.

It would be nice if you also had:

• Experience with wire bonding and surface-mounted device assembly.
• Familiarity with Manufacturing Execution Systems (MES).
• Strong attention to detail for inspecting workmanship.
• Ability to communicate effectively with team members and management.