Intern – Computer Science - Advance Packaging… at Micron… · Boise

Summary: Micron Technology is a world leader in innovating memory and storage solutions. They are seeking a motivated and talented intern to join their Advance Packaging Technology Development (APTD) team to enhance engineering efficiency through computer science, computer vision, and machine learning techniques. Responsibilities: - Collaborate with the APTD team to identify areas for improvement in engineering processes - Develop and implement machine learning models to optimize engineering workflows - Utilize computer vision techniques to enhance package design and development - Analyze large datasets to extract meaningful insights and drive data-driven decisions - Assist in the development of software tools and applications to support APTD projects - Participate in team meetings and contribute to brainstorming sessions Required Qualifications: - Currently pursuing a degree in Computer Science, Engineering, or a related field. Cannot graduate prior to September 2026 - Strong understanding of machine learning techniques and popular models (e.g., linear regression, SVM, XGBoost/LightGBM) - Experience with development tools such as Python, NumPy/Pandas, Scikit-learn, and one deep-learning framework (e.g., TensorFlow, Keras, PyTorch) - Familiarity with data exploration and visualization tools (e.g., matplotlib, Echarts) Preferred Qualifications: - Knowledge of SQL/NoSQL databases is a plus - Excellent written and verbal communication skills - Strong problem-solving skills and a proactive attitude Required Skills: Machine Learning, Python, Computer Vision Important Skills: Data Analysis, Deep Learning Framework Nice-to-Have Skills: SQL/NoSQL, Communication Skills, Problem-Solving Benefits: Choice of medical, dental and vision plans, Benefit programs that help protect your income if you are unable to work due to illness or injury, Paid family leave, Robust paid time-off program, Paid holidays