Engineer I - Materials at Microchip Technology Inc. in Lowell, MA

Summary: Microchip Technology Inc. is a global leader in semiconductor technology, known for its commitment to employee growth and innovation. They are seeking a motivated Manufacturing Engineer I to support engineering efforts related to semiconductor devices, focusing on material analysis and process development in a collaborative team environment. Responsibilities: - Support manufacturing and process development activities for semiconductor chip and wire assemblies, with emphasis on materials performance and reliability - Evaluate and characterize materials used in semiconductor assembly, including solders, brazes, epoxies, and encapsulation compounds - Partner with Operations and Engineering teams to troubleshoot manufacturing issues related to material defects, adhesion, thermal performance, and mechanical integrity - Participate in root cause investigations with focus on material-related failures such as delamination, corrosion, cracking, or contamination - Collect, analyze, and interpret production and material test data to identify opportunities for yield improvement and defect reduction - Support continuous improvement initiatives using statistical tools and structured problem-solving methods - Create and revise process documentation, work instructions, and training materials related to materials handling and processing - Learn and apply industry standards relevant to semiconductor assembly and materials reliability Required Qualifications: - Bachelor's degree in Materials Science, Materials Engineering, Mechanical Engineering, or a related engineering discipline - Strong organizational skills with the ability to manage multiple assignments - Effective verbal and written communication skills with the ability to work cross-functionally Preferred Qualifications: - 0 - 2.5 years of experience preferred in manufacturing, materials, or semiconductor environments preferred - Academic or practical experience with material characterization techniques (e.g., microscopy, hardness testing, thermal analysis, or spectroscopy) - Failure analysis or reliability testing - Exposure to statistical methods such as SPC, Gage R&R, DOE, 5 Why's, or Lean/6 Sigma concepts (academic or internship experience acceptable) - Exposure to semiconductor assembly processes such as die attach and wire bonding - Familiarity with soldering materials, brazing eutectics, epoxies and encapsulation materials through coursework or lab experience - Experience in using CAD, AutoCAD, SolidWorks or similar drafting software - Basic knowledge of industry standards such as MIL-PRF-19500, MIL-PRF-38534, or IPC standards Required Skills: Materials Science, Material characterization Important Skills: Statistical methods, Failure analysis Nice-to-Have Skills: CAD software, Effective communication, Organizational skills Benefits: Health benefits that begin day one, Retirement savings plans, Industry leading ESPP program with a 2 year look back feature