Semiconductor Packaging Engineering PHD Intern at Intel · US

Summary: Intel is shaping the future of technology to help create a better future for the entire world. The intern will contribute to the design and optimization of manufacturing engineering processes, assist in evaluating equipment performance, and collaborate with engineering teams to enhance production efficiency and product quality. Responsibilities: - Develop and validate computational fluid dynamics (CFD) models to simulate specific assembly processes of advanced semiconductor packages. Perform simulations to evaluate flow, capillary action, porous media properties and process optimization across a wide range of package architectures - The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids - The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems - The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches Required Qualifications: - Pursuing PhD degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with focus on computational fluid dynamics and two phase flows Preferred Qualifications: - Experience with Commercial CFD software such as: Ansys Fluent, Simulia Digital Rock, FlowScience Flow3D - Surface energy minimization software such as Surface Evolver - Material characterization: Rheology, surface energy, contact angle - Machine learning AI - Semiconductor packaging Required Skills: Computational Fluid Dynamics, Two Phase Flows Important Skills: Commercial CFD Software, Material Characterization, Machine Learning AI Nice-to-Have Skills: Semiconductor Packaging Benefits: Competitive pay, Stock bonuses, Health, Retirement, Vacation