Packaging Module Development Engineer at Intel in Phoenix, AZ

Summary: Intel is a leading company in semiconductor technology, and they are seeking a Packaging Module Development Engineer to contribute to the advancement of packaging technologies. The role involves developing interconnect and thermal solutions, collaborating with teams to optimize processes, and managing projects to meet development timelines. Responsibilities: - Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel’s future packaging platforms - Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability - Innovating next generation materials, equipment, and fabrication processes to enhance semiconductor packaging capabilities at scale - Managing projects to meet product development timelines - Applying formal education and judgment to solve technical problems - Providing sustaining support for equipment performance and process health in high-volume manufacturing - Responding promptly to foundry customer requests and events Required Qualifications: - PhD with one or more years in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related field - Minimum GPA of 3.5 - At least one publication in a peer-reviewed technical journal - Must have the required degree prior to your start date Preferred Qualifications: - One or more years of experience in technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE) - Delivering results for complex, time-critical technical projects - Semiconductor fabrication processes and technology - Previous related work experience in a semiconductor foundry Required Skills: Materials Science, Mechanical Engineering, Electrical Engineering, Statistical Process Control Important Skills: Design of Experiments, Semiconductor fabrication Nice-to-Have Skills: Analytical skills Benefits: Competitive pay, Stock bonuses, Health, Retirement, Vacation