Intel→
Packaging Module Development Engineer at Intel in Phoenix, AZ
Entry LevelOn-siteFull-timePhoenix, AZ$134k–$220k/yr
Skills
materials sciencemechanical engineeringelectrical engineeringphysicsstatistical process control (spc)design of experiments (doe)technology developmentsemiconductor fabrication processessemiconductor foundry experiencestrategic planninginfluencinganalytical skills
Job Description
Summary: Intel is a leading technology company focused on semiconductor packaging technologies for various computing platforms. The Packaging Module Development Engineer will develop interconnect and thermal interface solutions, collaborate with teams to optimize processes, and innovate materials and equipment for semiconductor packaging.
Responsibilities:
- Developing First, Second, and Mid-Level Interconnect (FLI, SLI, MLI) and thermal interface solutions to support Intel's future packaging platforms
- Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability
- Innovating next generation materials, equipment, and fabrication processes to enhance semiconductor packaging capabilities at scale
- Managing projects to meet product development timelines
- Applying formal education and judgment to solve technical problems
- Providing sustaining support for equipment performance and process health in high-volume manufacturing
- Responding promptly to foundry customer requests and events
Required Qualifications:
- PhD with one or more years in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related field
- Minimum GPA of 3.5
- At least three publications in a peer-reviewed technical journal
Preferred Qualifications:
- One or more years of experience in technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
- Delivering results for complex, time-critical technical projects
- Semiconductor fabrication processes and technology
- Previous related work experience in a semiconductor foundry
Required Skills: Materials Science, Mechanical Engineering, Electrical Engineering, Physics, Statistical Process Control (SPC), Design of Experiments (DOE), Technology development, Semiconductor fabrication processes, Semiconductor foundry experience, Strategic planning, Influencing, Analytical skills
Benefits: Health, Retirement, Vacation
Benefits
Health
Retirement
Vacation