Intel Process Integration Engineer - (FE) at Intel · US

Summary: Intel is a global leader in innovation and new technology, seeking a Process Integration Engineer to join their team in Hillsboro, Oregon. The role involves developing integrated front end process flows, optimizing device performance, and collaborating with cross-functional teams to enhance semiconductor manufacturing processes. Responsibilities: - Develop and define integrated front end process flows for new technology nodes - Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, and metrology teams - Establish process windows and integration schemes - Analyze yield loss and parametric failures - Perform root cause analysis using statistical tools (SPC, DOE, FMEA) - Drive corrective actions to improve yield and cycle time - Ensure electrical parameters meet design targets - Work closely with device engineers to tune process conditions - Optimize critical dimensions (CD), overlay, and film thickness - Implement control plans and process monitoring strategies - Use statistical tools such as: Cpk / Ppk, Control charts, Capability analysis - Support ramp from RnD to high-volume manufacturing (HVM) - Document process specifications and standard operating procedures (SOPs) - Work with Device Engineering, Equipment Engineering/Module Engineering, Yield Engineering, Reliability Teams, and Design Teams Required Qualifications: - Candidate must possess a PhD degree in one of these fields: Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering, Mechanical Engineering, or related discipline - Candidate must possess at least one of the following: 6+ months experience on one or more of the following areas: Semiconductor device fabrication or nanotechnology - Candidate must possess at least one of the following: 6+ months experience on one or more of the following areas: Electrical characterization of transistors or other semiconductor devices - Candidate must possess at least one of the following: 6+ months experience on one or more of the following areas: Clean room process development Preferred Qualifications: - JMP, MATLAB, Scripting languages (1.e. Python, JSL, TCL), or programming languages (1.e. SQL, C/C++) - Strong understanding of Device physics (CMOS, FinFET, GAA, etc) - Hand on experience in VLSI device fabrication and testing in the lab - Knowledge of basic VLSI fabrication instruments (1.e. mechanism of dry etcher, ALD (atomic layer deposition), PE CVD, metallization, etc.) - Understanding statistical process control and charting methodology data flow and integrity. Strong data analysis and presentation acumen - Integrated process knowledge, including strong design of experiments and model-based problem-solving skills for complex problems, excursions, and defects - Knowledge of automation and defect classification systems in a fab environment - Strong stakeholder management and influencing skills. Experience in coordination with other departments, co-workers, etc Required Skills: Semiconductor Device Fabrication, Nanotechnology, Electrical Characterization of Transistors, Clean Room Process Development, JMP, MATLAB, Python, JSL, TCL, SQL, C/C++, Device Physics, VLSI Device Fabrication, VLSI Testing, Dry Etcher Mechanism, Atomic Layer Deposition (ALD), Plasma Enhanced Chemical Vapor Deposition (PE CVD), Metallization, Statistical Process Control, Design of Experiments, Model-Based Problem Solving, Automation Systems, Defect Classification Systems, Stakeholder Management, Influencing Skills Benefits: Competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation), Excellent medical plans, Wellness programs, Amenities, Time off, Recreational activities, Discounts on various products and services, Many more creative perks that make Intel a Great Place to Work, Generous benefits to help you achieve your goals