Hardware and Systems Developer Intern 2027 -New… at IBM · Location…

IBM Hardware and Systems engineers design and deliver the compute platforms that power the world’s most advanced AI, cloud, and enterprise technologies. From silicon to system, our teams collaborate across mechanical, electrical, computer, materials, and firmware engineering to design, prototype, and test next-generation IBM hardware. We are seeking Hardware and Systems Development Interns to join our U.S. development labs for 2026. These roles provide hands-on experience in design, prototyping, testing, and process development across IBM’s high-performance systems portfolio. As an intern, you will: Collaborate across disciplines to design, model, and validate next-generation hardware. Support mechanical, thermal, electrical, optical, and logic design using CAD, EDA, and simulation tools. Participate in PCB layout, power and signal integrity, circuit design, and system bring-up. Conduct experiments, analyze data, and contribute to reliability, process, and materials development projects. Write scripts and automation tools using Python, C/C++, or Bash to support testing and validation. You’ll have opportunities to work in focus areas such as: Mechanical & Thermal Design – SolidWorks, CFD, FEM, design for manufacturing, and reliability testing. Electrical & Logic Design – PCB/IC layout (Cadence, Allegro), digital logic, circuit, and system design. Optics & Photonics – Fiber optics, photonics, lasers (DFB, VCSEL), optical networking, and data center systems. Materials & Process Engineering – Composites, metallurgy, heat transfer, and process development. B.S. or M.S. student in Mechanical, Electrical, Materials, Chemical, Industrial, or related Engineering disciplines. Strong academic background with an interest in hardware design, optics, logic, process, or materials engineering. Experience with CAD tools (SolidWorks, AutoCAD, Allegro, Cadence) and/or simulation tools (CFD, FEM, HFSS). Programming experience with Python, C/C++, or Bash for automation or data analysis. Strong analytical, problem-solving, and teamwork skills. Experience with test automation. Hands-on experience with lab tools (LabVIEW, MATLAB, oscilloscopes, thermal chambers, or optical test equipment). Familiarity with design of experiments (DOE) or project management in a research or lab environment. Experience in signal or power integrity modeling, optical systems, logic design, or materials process engineering. M.S. or Ph.D. students with a research focus in electrical packaging, photonics, signal integrity, or thermal design are encouraged to apply. United States Infrastructure & Technology Hybrid Internship Multiple Cities (0147) International Business Machines Corporation