Software Engineering Intern at Cadence in San Jose, CA

Summary: Cadence is a company that hires and develops leaders and innovators in technology. They are seeking a Software Engineering Intern responsible for designing, developing, troubleshooting, and debugging PCB/package/chip thermal analysis software. Responsibilities: - Responsible for designing, developing, troubleshooting and debugging PCB/package/chip thermal analysis software - Works on extremely complex problems where analysis of situations or data requires an evaluation of intangible variance factors Required Qualifications: - The candidate should be attending a BS, MS or PhD program in ME/EE/CS - have strong programming skills in C++ - deep familiarity with object-oriented programming methods Preferred Qualifications: - Prior knowledge and experience with distributed/multi-threaded programming - numerical analysis techniques - meshing techniques - finite-element based thermal simulation - CFD analysis - in-depth understanding of electric cooling of PCB/package/chip - Experience on automatic design optimization for thermal targets Required Skills: C++, Object-oriented programming, Distributed programming, Multi-threaded programming, Numerical analysis, Meshing techniques, Finite-element thermal simulation, CFD analysis, Electric cooling of PCB/package/chip, Automatic design optimization for thermal targets