BAE Systems→
Microwave Technician II at BAE Systems in Location not listed
Entry LevelOn-siteFull-timeNot specified
Job Description
Please note this position supports our Weekend night Shift working Friday, Saturday and Sunday from 3:00PM to 3:00AM. You will work 36 Hours and be paid for 40 Hours plus earn a 15% pay premium.
See what you’re missing. Our employees work on the world’s most advanced electronics – from detecting threats for F-35 pilots to illuminating the night for soldiers. Spanning air, land, sea, and space, we are developing the technology of tomorrow, delivered today. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our mission: “We Protect Those Who Protect Us®.” Sound like a team you want to be a part of? Come build your career with BAE Systems. Electronic Combat Solutions (ECS) has technology, engineering and program teams that educate and mentor colleagues to deliver leading Electronic Warfare capabilities. We welcome all those who have big ideas, crave innovation, want to drive fielding velocity, and have the passion to bring the warfighter home safely.
Role Summary
The MRSI Die Bonding Assembly Technician is responsible for the high-precision attachment of semiconductor dies to substrates, specifically within the production of RF and microwave components. This role requires extreme attention to detail, mastery of micro-assembly techniques, and the ability to work under high-magnification optics to ensure the electrical and mechanical integrity of mission-critical components.
Key Responsibilities
See what you’re missing. Our employees work on the world’s most advanced electronics – from detecting threats for F-35 pilots to illuminating the night for soldiers. Spanning air, land, sea, and space, we are developing the technology of tomorrow, delivered today. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our mission: “We Protect Those Who Protect Us®.” Sound like a team you want to be a part of? Come build your career with BAE Systems. Electronic Combat Solutions (ECS) has technology, engineering and program teams that educate and mentor colleagues to deliver leading Electronic Warfare capabilities. We welcome all those who have big ideas, crave innovation, want to drive fielding velocity, and have the passion to bring the warfighter home safely.
Role Summary
The MRSI Die Bonding Assembly Technician is responsible for the high-precision attachment of semiconductor dies to substrates, specifically within the production of RF and microwave components. This role requires extreme attention to detail, mastery of micro-assembly techniques, and the ability to work under high-magnification optics to ensure the electrical and mechanical integrity of mission-critical components.
Key Responsibilities
- Die Attach Operations: Perform precision die bonding using various methods, including epoxy bonding and eutectic bonding, ensuring accurate placement and orientation of dies on substrates.
- Equipment Operation: Operate and maintain automated and semi-automated die bonders and curing ovens.
- Microscope Proficiency: Utilize high-power microscopes for alignment, inspection, and verification of bond quality and die placement.
- Quality Control: Conduct visual inspections and perform in-process quality checks to ensure components meet strict RF microwave specifications and tolerances.
- Technical Documentation: Maintain accurate production logs, route sheets, and quality reports. Document any deviations or non-conformances in accordance with factory standards.
- Collaboration: Work closely with Process Engineers to optimize bonding parameters and troubleshooting assembly failures.
- Ability to sit or stand for long periods while performing precision work.
- Manual dexterity required for handling fragile components and small tools.
- Ability to work in a controlled cleanroom environment.