Mgr II- Eng Mfg at BAE Systems in Location not listed

The Manufacturing Engineering Manager is responsible for leading a team of manufacturing engineers to develop, optimize, and maintain manufacturing processes and equipment. This role provides leadership, technical direction, and mentoring to a team of engineers responsible for the development, implementation, and optimization of manufacturing processes and equipment for complex commercial and defense products. The ideal candidate will possess a strong technical background in manufacturing engineering, a proven track record of leadership, and a deep understanding of quality systems (AS9100), lean manufacturing principles, and commercial/aerospace/defense industry regulations. This position will be a key driver in ensuring product manufacturability, quality, cost-effectiveness, and on-time delivery.

This leader will be responsible for the day to day operation of the Circuit Card manufacturing engineering team across multiple shifts in Endicott, NY. The broader CCA (Circuit Card Assembly) team produces approximately 40,000 CCA's per year and shows growth year over year. These CCA's support all product lines in Endicott, NY including both commercial and military applications. Will be responsible for a team of approximately 20 manufacturing engineers and manufacturing technicians that support both production and development programs.

Team Leadership:

• Manage and develop a team of engineers and engineering assistance across work cells and shifts to meet production and business objectives. The team is is responsible for creating and updating work instructions for first time builds and recurring production.
• Manage team workload, prioritize projects, and ensure resource allocation to meet production and business objectives.
• Set performance expectations, conduct performance evaluations, coaching, and training to support team growth and accountability.
• Promote a positive and inclusive work environment that reflects BAE Systems' core values.
• Managing the process engineers that are responsible for the technical support of the Printed Circuit Assembly (PCA) area and the associated equipment with the exception of equipment maintenance.

Cross-Functional Coordination

• Working with the Operational Excellence (OpEx) team to ensure we have well developed equipment roadmaps that support the future technology demands of CCA manufacturing. This roadmap also needs to include the life cycle management of the existing equipment.
• Work collaboratively with other functions such as finance, programs, and engineering to ensure optimal performance of the team.
• Drive conversations with design engineering on the front end of programs to improve product producibility and ensure we have process capability to support the needs. Participate in regular discussions with Engineering regarding their roadmaps to evaluate the impact to production.
• Represent the Manufacturing Engineering team in cross-functional meetings.

Process, Procedures, Equipment, & Automation

• Oversee selection, installation, and qualification of manufacturing capital equipment and documentation.
• Identify and implement automation opportunities to improve efficiency and reduce labor costs
• Manage preventive maintenance strategies and equipment uptime.
• Manage MES process & test procedure deployment, change orders, and automation.

Performance and Goals

• Monitor production metrics (COPQ, HPU’s, DPU, utilization and inventory optimization) and develop technical action plans to meet or exceed targets.
• Shape the manufacturing technology roadmap with the manufacturing leadership team. Manage annual capital investment plans and proposals.
• Creating business justifications for capital investments to ensure PCA area overall success. Ensure that investment projects are executed on cost and schedule.

This role will be a key member of the PCA leadership team to ensure the development and execution of the broader strategic plan for the area.