University of Bristol - School of Physiology, Pharmacology and Neuroscience→
Postdoctoral Research Associate in Ultra-High Power Wide Bandgap Semiconductor RF Devices
InternshipOn-site
Location
Bristol, CT
Salary
$48k–$54k/yr
Experience
Not specified
Posted
3 days ago
Skills
tcad device modellingwide bandgap semiconductor materialsultra-wide bandgap semiconductor materialsgan semiconductor devicesga2o3 semiconductor devicesfinite element thermal modellingphysics-based modellingelectrical characterizationthermal characterizationdevice failure analysisdevice reliability analysisco-supervision
Job Description
Summary: The University of Bristol is seeking a Postdoctoral Researcher at the Centre for Device Thermography and Reliability (CDTR) to advance wide and ultra-wide bandgap semiconductor materials device technologies. The role involves developing TCAD device simulations, conducting thermal simulations, and collaborating with industrial partners and team researchers.
Responsibilities:
- Conduct research to advance wide and ultra-wide bandgap semiconductor materials device technologies and its understanding
- Develop device simulation TCAD models to complement experiments and to support device design and to analyse device failure, breakdown and reliability
- Develop thermal material/device thermal models for device design using finite element and other simulation tools and support short-term industrial contract
Required Qualifications:
- Postgraduate (PhD) experience in Physics, Materials Science or Engineering, or be working towards one, or equivalent professional qualification/experience
- Extensive expertise required in TCAD device modelling
- A willingness to work together with, and co-supervise, PhD students is necessary
Preferred Qualifications:
- Ideally with a good publication record
- Desirable experience in finite element thermal modelling, physics-based modelling and electrical/thermal characterization of materials or devices
Required Skills: TCAD device modelling, Wide bandgap semiconductor materials, Ultra-wide bandgap semiconductor materials, GaN semiconductor devices, Ga2O3 semiconductor devices, Finite element thermal modelling, Physics-based modelling, Electrical characterization, Thermal characterization, Device failure analysis, Device reliability analysis, Co-supervision