Thermo-Mech CFD Simulation Intern - Summer 2027

Summary: Etched is building the world’s first AI inference system purpose-built for transformers. They are seeking a Thermo-Mechanical, CFD Simulation Engineering Intern to focus on Chip-on-Wafer-on-Substrate (CoWoS) package development, performing critical thermo-mechanical/CFD analysis to contribute to next-generation high-performance computing systems. Responsibilities: - Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL - Perform thermo-mechanical stress/strain analysis and thermal cycling simulations - Analyze package warpage, solder joint reliability, and interconnect stress - Develop CFD models using ANSYS FLUENT for solder reflow modeling - Collaborate with design engineering teams on package development Required Qualifications: - Pursuing a degree in Mechanical Engineering or related field - Academic or project experience with FEA/CFD tools and analysis - Proficiency in SOLIDWORKS/NX, ANSYS Mechanical APDL and ANSYS FLUENT - Understanding of semiconductor packaging materials and processes - Strong grasp on non-linear properties of materials (elastic-plastic, viscoelastic) - Familiarity with CoWoS-S/L/R, TSVs, or 2.5D/3D integration concepts - Basic programming/scripting skills (APDL, Python, MATLAB) Preferred Qualifications: - Knowledge of solder joint reliability and failure analysis - Familiarity with JEDEC standards and reliability testing - Previous internship in semiconductor industry Required Skills: ANSYS Mechanical APDL, ANSYS FLUENT, FEA modeling, CFD modeling, Thermo-mechanical stress analysis, Thermal cycling simulations, Package warpage analysis, Solder joint reliability analysis, Interconnect stress analysis, SOLIDWORKS, NX, Semiconductor packaging materials, Non-linear material properties, CoWoS packaging, TSVs, 2.5D integration, 3D integration, APDL scripting, Python programming, MATLAB programming Internship Start Date: Start in 2027 Summer Benefits: Generous housing support for those relocating, Daily lunch and dinner in our office, Direct mentorship from industry leaders and world-class engineers