Thermo-Mech CFD Simulation Intern - Spring 2027

Summary: Etched is building an innovative AI inference system for transformers, aiming to deliver unprecedented performance and cost efficiency. They are seeking a Thermo-Mechanical, CFD Simulation Engineering Intern to join their Advanced IC Packaging Team, focusing on CoWoS package development and performing critical analysis to support high-performance computing systems. Responsibilities: - Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL - Perform thermo-mechanical stress/strain analysis and thermal cycling simulations - Analyze package warpage, solder joint reliability, and interconnect stress - Develop CFD models using ANSYS FLUENT for solder reflow modeling - Collaborate with design engineering teams on package development Required Qualifications: - Pursuing a degree in Mechanical Engineering or related field - Academic or project experience with FEA/CFD tools and analysis - Proficiency in SOLIDWORKS/NX, ANSYS Mechanical APDL and ANSYS FLUENT - Understanding of semiconductor packaging materials and processes - Strong grasp on non-linear properties of materials (elastic-plastic, viscoelastic) - Familiarity with CoWoS-S/L/R, TSVs, or 2.5D/3D integration concepts - Basic programming/scripting skills (APDL, Python, MATLAB) Preferred Qualifications: - Knowledge of solder joint reliability and failure analysis - Familiarity with JEDEC standards and reliability testing - Previous internship in semiconductor industry Required Skills: ANSYS Mechanical APDL, ANSYS FLUENT, FEA modeling, CFD modeling, Thermo-mechanical stress/strain analysis, Thermal cycling simulations, Package warpage analysis, Solder joint reliability analysis, Interconnect stress analysis, SOLIDWORKS, NX, Semiconductor packaging materials, Non-linear material properties, CoWoS-S/L/R, TSVs, 2.5D integration, 3D integration, APDL scripting, Python programming, MATLAB programming Internship Start Date: Start in 2027 Spring Benefits: Generous housing support for those relocating, Daily lunch and dinner in our office, Direct mentorship from industry leaders and world-class engineers, Based at our office in San Jose, CA